2sK3667 2006-11-08 1 toshiba field effect transistor silicon n channel mos type ( -mosvi) 2sK3667 switching regulator applications ? low drain-source on resistance: r ds (on) = 0.75 (typ.) ? high forward transfer admittance: |y fs | = 5.5s (typ.) ? low leakage current: i dss = 100 a (v ds = 600 v) ? enhancement mode: v th = 2.0~4.0 v (v ds = 10 v, i d = 1 ma) absolute maximum ratings (ta = 25c) characteristics symbol rating unit drain-source voltage v dss 600 v drain-gate voltage (r gs = 20 k ? ) v dgr 600 v gate-source voltage v gss 30 v dc (note 1) i d 7.5 drain current pulse (t = 1 ms) (note 1) i dp 30 a drain power dissipation (tc = 25c) p d 45 w single pulse avalanche energy (note 2) e as 189 mj avalanche current i ar 7.5 a repetitive avalanche energy (note 3) e ar 4.5 mj channel temperature t ch 150 c storage temperature range t stg -55~150 c note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/derating concept and methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). thermal characteristics characteristics symbol max unit thermal resistance, channel to case r th (ch-c) 2.78 c/w thermal resistance, channel to ambient r th (ch-a) 62.5 c/w note 1: ensure that the channel temperature does not exceed 150 . note 2: v dd = 90 v, t ch = 25c, l = 5.88 mh, i ar = 7.5 a, r g = 25 ? note 3: repetitive rating: pulse width limited by maximum channel temperature this transistor is an electrostatic-sensitive device. please handle with caution. unit: mm 1: gate 2: drain 3: source jedec D jeita sc-67 toshiba 2-10u1b weight : 1.7 g (typ.) 1 3 2
2sK3667 2006-11-08 2 electrical characteristics (ta = 25c) characteristics symbol test condition min typ. max unit gate leakage current i gss v gs = 25 v, v ds = 0 v ? ? 10 a gate-source breakdown voltage v (br) gss i g = 10 a, v ds = 0 v 30 ? ? v drain cut-off current i dss v ds = 600 v, v gs = 0 v ? ? 100 a drain-source breakdown voltage v (br) dss i d = 10 ma, v gs = 0 v 600 ? ? v gate threshold voltage v th v ds = 10 v, i d = 1 ma 2.0 ? 4.0 v drain-source on resistance r ds (on) v gs = 10 v, i d = 4 a ? 0.75 1.0 ? forward transfer admittance ? y fs ? v ds = 10 v, i d = 4 a 1.5 5.5 ? s input capacitance c iss ? 1300 ? reverse transfer capacitance c rss ? 12 ? output capacitance c oss v ds = 25 v, v gs = 0 v, f = 1 mhz ? 120 ? pf rise time t r ? 20 ? turn-on time t on ? 50 ? fall time t f ? 35 ? switching time turn-off time t off ? 150 ? ns total gate charge q g ? 33 ? gate-source charge q gs ? 18 ? gate-drain charge q gd v dd ? = 10 v, i d = 7.5 a ? 15 ? nc source-drain ratings and characteristics (ta = 25c) characteristics symbol test condition min typ. max unit continuous drain reverse current (note 1) i dr ? ? ? 7.5 a pulse drain reverse current (note 1) i drp ? ? ? 30 a forward voltage (diode) v dsf i dr = 7.5 a, v gs = 0 v ? ? ? 1.7 v reverse recovery time t rr ? 1200 ? ns reverse recovery charge q rr i dr = 7.5 a, v gs = 0 v, di dr /dt = 100 a/ s ? 12 ? c marking r l = 50 ? 0 v 10 v v gs v dd ? = 4 a v out 50 ? duty < = = 10 s lot no. (weekly code) a line indicates lead (pb)-free package or lead (pb)-free finish. K3667 part no. (or abbreviation code)
2sK3667 2006-11-08 3 10 6 4 0 8 2 0 4 8 12 16 v gs = 4v 4.5 5 4.75 5.25 6 10,8 20 5.5 16 12 8 4 0 20 0 20 50 4.5 4.75 5.25 10 5 40 30 10 8 6 v gs = 4 v 5.5 0 0 2 4 6 8 10 8 20 tc = ? 55c 25 100 12 4 16 0 6 8 10 0 i d = 10 a 4 12 16 20 2.5 5 4 2 8 0.1 1 100 0.1 1 100 25 100 tc = ? 55c 10 10 0.1 0.1 1 100 10 v gs = 10 v ? 15v 10 1 drain-source voltage v ds (v) i d ? v ds drain current i d (a) common source tc = 25c pulse test drain current i d (a) r ds (on) ? i d drain-source on resistance r ds (on) ( ? ) common source tc = 25c pulse test drain current i d (a) ? y fs ? ? i d common source v ds = 20 v pulse test forward transfer admittance ? y fs ? (s) drain-source voltage v ds (v) i d ? v ds drain current i d (a) common source tc = 25c pulse test gate-source voltage v gs (v) i d ? v gs drain current i d (a) common source v ds = 20 v pulse test drain-source voltage v ds (v) gate-source voltage v gs (v) v ds ? v gs common source tc = 25 pulse test
2sK3667 2006-11-08 4 1 0.1 10 100 1000 10000 1 10 100 c iss c oss c rss 160 ? 40 0 40 80 120 ? 80 4 3 2 1 0 i d = 7.5a 2 4 0 1 2 3 5 ? 80 ? 40 0 40 80 120 160 4 0 0.1 ? 0.2 1 10 100 ? 0.6 ? 0.8 ? 1.2 v gs = 0, ? 1 v 10 5 1 3 ? 0.4 ?1.0 0 10 30 v dd = 100 v v ds v gs 400 200 40 50 500 200 100 300 400 0 20 20 8 4 12 16 0 60 0 0 40 80 120 160 20 40 200 drain-source voltage v ds (v) capacitance ? v ds capacitance c (pf) common source v gs = 0 v f = 1 mhz tc = 25c drain power dissipation p d (w) case temperature tc (c) p d ? tc drain-source voltage v ds (v) i dr ? v ds drain reverse current i dr (a) common source tc = 25c pulse test gate threshold voltage v th (v) case temperature tc (c) v th ? tc common source v ds = 10 v i d = 1 ma pulse test case temperature tc (c) r ds (on) ? tc drain-source on resistance r ds (on) ( ? ) common source v gs = 10 v pulse test gate-source voltage v gs (v) total gate charge q g (nc) dynamic input / output characteristics drain-source voltage v ds (v) common source i d = 7.5 a tc = 25c pulse test
2sK3667 2006-11-08 5 400 300 200 100 0 25 50 75 100 125 150 0.01 0.1 1 10 0.001 10 100 1 10 100 1 10 t p dm t duty = t/t r th (ch-c) = 2.78c/w 0.2 0.1 0.02 0.01 0.05 channel temperature (initial) t ch (c) e as ? t ch avalanche energy e as (mj) r th ? t w pulse width t w (s) normalized transient thermal impedance r th (t) /r th (ch-c) duty=0.5 single pulse ? 15 v 15 v test circuit wave form i ar b vdss v dd v ds r g = 25 ? v dd = 90 v, l = 5.88mh ? ? ? ? ? ? ? ? ? ? ? ? = v dd b vdss b vdss 2 i l 2 1 as drain-source voltage v ds (v) safe operating area 0.1 1 1 10 100 10 1000 100 0.01 single nonrepetitive pulse tc=2 5 curves must be derated linearly with increase in temperature . i d max (pulsed) * i d max (continuous) * dc operation tc = 25c 100 s * 1 ms * v dss max drain current i d (a)
2sK3667 2006-11-08 6 ? the information contained herein is subject to change without notice. ? the information contained herein is presented only as a guide for the applications of our products. no responsibility is assumed by toshiba for any infringements of patents or other rights of the third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of toshiba or others. ? toshiba is continually working to improve the quality an d reliability of its products. nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. it is the responsibility of the buyer, when utilizing toshiba products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such toshiba products could cause loss of human life, bodily injury or damage to property. in developing your designs, please ensure that toshiba products are used within specified operating ranges as set forth in the most recent toshiba products specifications. also, please keep in mind the precautions and conditions set forth in the ?handling guide for semiconductor devices,? or ?toshiba semiconductor reliability handbook? etc.. ? the toshiba products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). these toshiba products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfuncti on or failure of which may cause loss of human life or bodily injury (?unintended usage?). unintended usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. unintended usage of toshiba products listed in this document shall be made at the customer?s own risk. ? toshiba products should not be embedded to the downstream products which are prohibited to be produced and sold, under any law and regulations. 030619eaa restrictions on product use
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